SEM can be used for microscopic morphology observation, cross-section preparation, defect analysis, and failure analysis of printed circuit boards (PCBs) and flexible printed circuit boards (FPCs). It can inspect the surface morphology and adhesion between copper foil and resin substrates, dry film adhesion and detachment, and the degree of nickel corrosion, and rapidly measure intermetallic compound (IMC) layer thickness to evaluate soldering reliability. For complex structures such as multilayer boards, blind vias, and buried vias, combined with ion beam milling, it enables cross-section preparation and internal defect localization, solving the problems of traditional cross-sectioning, such as high destructiveness and difficulty in compositional analysis.
